ESSDERC

1. Advanced Technology,

Process and Materials

Process and material developments for logic, memory and non CMOS, including electrical and physico-chemical characterization, process integration and manufacturing: 2D TMDs, graphene, TFTs, gate oxide, gate material, silicide, BEOL materials, 3D monolithic as well as conventional and novel memory cells including charge-based memories, ReRAM, MRAM, PCRAM, FeRAM, crosspoint and selectors, organic memory...

 

2. Analog, Power

and RF Devices

From material growth to device, components and systems (process, design, devices fabrication, applications. Si-based RF CMOS, RF SOI, SiGe HBTs, as well as devices and electrical characterizations on SiC, InP/InGaAs/ GaAs, AlGaN/InGaN/GaN, CNT, diamond”. Power systems integration and reliability (thermal management, packaging technologies, electro thermal characterization, reliability)

 

3. Compact Modeling 

and Process/Device Simulation

(including TCAD and advanced simulation techniques and studies) Compact/SPICE modeling of electronic, optical, organic, and hybrid devices and their IC implementation and interconnection. Verilog-A models of the semiconductor devices (including Bio/Med sensors, MEMS, Microwave, RF, High voltage and Power, emerging technologies and novel devices), parameter extraction, reliability and variability, performance evaluation and open source benchmarking/ implementation methodologies. Modeling of interactions between process, device and circuit design, Design Technology Co-Optimization, Foundry/Fabless Interface Strategies. Numerical, analytical, statistical modeling and simulation of electronic, optical and hybrid devices, interconnect, isolation and 2D/3D integration; Aspects of materials, fabrication processes and devices e.g. advanced physical phenomena (quantum mechanical and non-stationary transport phenomena, ballistic transport, ...); Mechanical or electro-thermal modeling and simulation; DfM. Reliability of materials and devices. Design- Technology-Co-Optimization.

ESSCIRC

4. Analog

Amplifiers, drivers, comparators, filters, references, analog systems and analog techniques.

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5. Data Converters

Nyquist-rate and oversampling A/D and D/A converters; capacitance-to-digital, time-to-digital, frequency-to- digital converters; embedded and application-specific A/D and D/A converters; analog to information conversion; A/D and D/A converter building blocks (sample-and-hold circuits, calibration circuits, etc.); enabling new techniques, architectures, or technologies.

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6. RF & mm-Wave

Building blocks operating at RF, mm-Wave and THz frequencies for wireless communication, radar, sensing and imaging.

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7. Frequency Generation

Oscillators and controlled oscillators, PLL, DLL, injection locked oscillators, frequency dividers, any kind of frequency generation or time base circuits and systems.

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8. Digital Circuits & Systems

Digital circuits and memory subsystems for microprocessors, micro-controllers, application processors, graphics processors; digital systems for communications, video and multimedia. Digital design techniques for power reduction, intra-chip communication, clock distribution, soft-error and variation-tolerant design, system-level integration.

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9. Power Management

Power management and control circuits, regulators; switched-mode power converter ICs using inductive, capacitive, and hybrid techniques; energy harvesting circuits and systems; wide-bandgap topologies and gate-drivers; power and signal isolators; robust power management circuits for automotive and other harsh environments; circuits for lighting, wireless power and envelope modulators.

 

10.Wireless & Wireline

Circuits & Systems

Wireless and wireline circuits and systems, 2.5/3D interconnect, copper-cable links, and equalizing on-chip links, exploratory I/O circuits for advancing data rates, radio transceiver SoC or SiP at RF/mmW and THz frequencies, chip to chip system communications, high speed serial interfaces, optical interfaces, established standards communication system full chip solutions.

JOINT

11. Emerging Computing Devices and Circuits

(including Advanced CMOS, post-CMOS, Quantum Computing, Cryogenic Circuits) Novel devices and circuit concepts that improve existing and enable novel computing paradigms. Included in the scope of this track are Advanced CMOS and beyond CMOS transistor (e.g. tunnel FET, negative capacitance FET), transistors based on low- dimensional systems (e.g. 2D materials, nanowires, and quantum dots), and on topological insulators, as well as phase transitions transistors and all kind of circuit implementations with such devices. Qubit devices for quantum computing enablement and all related Cryogenic Circuits are welcomed. Non-charge-based logic devices and circuits (e.g. magnetic logic, spintronics, and plasmonics) are also key topics of this track.

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12. Memory Devices & Circuits Towards Non Von Neumann

(including Neuromorphic Computing, AI Accelerators, in-Memory-Computing, Security) Emerging devices and materials in neuromorphic computing. New materials, and new uses for established materials, within the context of neuromorphic computing algorithms, ranging from deep neural networks (deep learning) to more bio-inspired networks and algorithms. Resistive switching materials including phase change materials for neuromorphic computing. Ferroelectric materials for neuromorphic computing. Materials for spintronic implementations of neuromorphic computing. Edge and cloud AI computing platforms. Silicon implementation of Neuromorphic circuits, processors, systems and their applications. In-Memory-Computing and Security.

13. Devices & Circuits for Sensors, Optoelectronics & Display

(including MEMS, Bioelectronics, Biomedical, and Imaging) Image sensors and SoCs; automotive, LIDAR, and ultrasonic sensors; MEMS sensor systems; wearable, implantable, ingestible electronics, biomedical SoCs, neural interfaces and closed-loop systems; biosensors, microarrays, and lab-on-a-chip; display electronics, displays with sensing functionality; sensing for AR/VR.