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50th European Solid-State Device Research Conference
50th European Solid-State Device Research Conference
2021 EDUCATIONAL EVENTS
2. Devices and circuits enabling the path towards 6G
Chairs: Stefan Andersson (Ericsson) and Nadine Collaert (imec)
2.1) 5G evolution and 6G: benefits and challenges
Takehiro Nakamura (NTT Docomo, Japan)
2.2) Millimeter-wave/THz Phased-Array Transceiver for Beyond 5G
Kenichi Okada (Tokyo Institute of Technology, Japan)
2.3) Millimeter Wave and Sub-THz Power Amplifiers ― Enabling Technologies for Beyond-5G and 6G Wireless Networks
Hua Wang (ETH Zurich, Switzerland)
2.4) DSP-assisted RF-sampling data converters for 5G soft radio and beyond
Martin Clara (Intel, USA)
2.5) Packaging requirements for mmW & THz wireless applications
Ivan Ndip (Fraunhofer IZM, Germany)
2.6) THz circuits and applications
Patrick Reynaert (KU Leuven, imec, Belgium)
2.7) InP technologies for mmW & THz wireless applications
Miguel Urteaga (Teledyne, USA)
2.8) SiGe HBT devices/circuits for mmW & THz wireless applications
Ullrich Pfeiffer (University of Wuppertal, Germany)