IEEE 51st European Solid-State Device Research Conference


IEEE 47th European Solid-State Circuits Conference

2. Devices and circuits enabling the path towards 6G
Chairs: Stefan Andersson (Ericsson) and Nadine Collaert (imec)
2.1) 5G evolution and 6G: benefits and challenges
Takehiro Nakamura (NTT Docomo, Japan)

2.2) Millimeter-wave/THz Phased-Array Transceiver for Beyond 5G

Kenichi Okada (Tokyo Institute of Technology, Japan)

2.3) Millimeter Wave and Sub-THz Power Amplifiers ― Enabling Technologies for Beyond-5G and 6G Wireless Networks

Hua Wang (ETH Zurich, Switzerland)

2.4) DSP-assisted RF-sampling data converters for 5G soft radio and beyond

Martin Clara (Intel, USA)

2.5) Packaging requirements for mmW & THz wireless applications

Ivan Ndip (Fraunhofer IZM, Germany)


2.6) THz circuits and applications

Patrick Reynaert (KU Leuven, imec, Belgium)


2.7) InP technologies for mmW & THz wireless applications

Miguel Urteaga (Teledyne, USA)

2.8) SiGe HBT devices/circuits for mmW & THz wireless applications

Ullrich Pfeiffer (University of Wuppertal, Germany)