Click on titles to see abstracts and biosketches or go back to Virtual Educationals main page

6. High Density 3D CMOS Mixed-Signal Opportunities
Chair: Philipp Häfliger (University of Oslo)


6.1) Introduction: The 3D-MUSE project
Philipp Häfliger (University of Oslo, Norway)

6.2) 3D sequential integration: opportunities and challenges
Perrine Batude (CEA-LETI, France)

6.3) Merging PDKs to build a multi-process multi-tier 3D design environment
Mehdi Mouhdach, Olivier Billoint (CEA-LETI, France)

Applications

• 6.4) 14-bits Cyclic ADC in 3D sequential multi-process technology

Truong Thi Kim Nga, Philipp Häfliger (University of Oslo, Norway)

•  6.5) Innovative Fine Pitch Architectures dedicated to Image Sensors: from Hybrid Bonding to 3D Sequential integration

Jean Michailos (STMicroelectronics, France)

• 6.6)  3D Integrated Circuits for Radiation Sensor Readout

Joar Østby (Integrated Detector AS, Norway), Haiattullah Gholami (University of Oslo, Norway), Dirk Meier (Integrated Detector AS,Norway)