IEEE 51st European Solid-State Device Research Conference


IEEE 47th European Solid-State Circuits Conference

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6. High Density 3D CMOS Mixed-Signal Opportunities
Chair: Philipp Häfliger (University of Oslo)

6.1) Introduction: The 3D-MUSE project
Philipp Häfliger (University of Oslo, Norway)

6.2) 3D sequential integration: opportunities and challenges
Perrine Batude (CEA-LETI, France)

6.3) Merging PDKs to build a multi-process multi-tier 3D design environment
Mehdi Mouhdach, Olivier Billoint (CEA-LETI, France)

  • 6.4) 14-bits Cyclic ADC in 3D sequential multi-process technology
Truong Thi Kim Nga, Philipp Häfliger (University of Oslo, Norway)
  •  6.5) Innovative Fine Pitch Architectures dedicated to Image Sensors: from Hybrid Bonding to 3D Sequential integration
Jean Michailos (STMicroelectronics, France)
  • 6.6)  3D Integrated Circuits for Radiation Sensor Readout
Joar Østby (Integrated Detector AS, Norway), Haiattullah Gholami (University of Oslo, Norway), Dirk Meier (Integrated Detector AS,Norway)