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50th European Solid-State Device Research Conference
50th European Solid-State Device Research Conference
2021 EDUCATIONAL EVENTS
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6. High Density 3D CMOS Mixed-Signal Opportunities
Chair: Philipp Häfliger (University of Oslo)
6.1) Introduction: The 3D-MUSE project
Philipp Häfliger (University of Oslo, Norway)
6.2) 3D sequential integration: opportunities and challenges
Perrine Batude (CEA-LETI, France)
6.3) Merging PDKs to build a multi-process multi-tier 3D design environment
Mehdi Mouhdach, Olivier Billoint (CEA-LETI, France)
Applications
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6.4) 14-bits Cyclic ADC in 3D sequential multi-process technology
Truong Thi Kim Nga, Philipp Häfliger (University of Oslo, Norway)
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6.5) Innovative Fine Pitch Architectures dedicated to Image Sensors: from Hybrid Bonding to 3D Sequential integration
Jean Michailos (STMicroelectronics, France)
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6.6) 3D Integrated Circuits for Radiation Sensor Readout